Product Specifications (Advanced Purity Focus)

Attribute	Technical Data	Unique Value Proposition
Purity Level	99.9%+ (Total impurities ≤0.1%)	Guaranteed via GDMS* analysis (detection limit: 0.0001%)
Key Impurities	C ≤0.002%, S ≤0.001%, P ≤0.001%, O ≤0.0005%	Optimized for ultra-high vacuum (UHV) compatibility
Physical Forms	Foil (0.1-5mm), Rod (Ø5-200mm), Custom Sputtering Targets	Pre-polished surfaces (Ra ≤0.2μm) available
Certifications	ISO 17025, IATF 16949, USP Class VI (Biocompatible)	Compliant with semiconductor fab protocols (SEMI F72)
Critical Properties	Resistivity ≤12 μΩ·cm	Thermal Conductivity 80 W/m·K

Glow Discharge Mass Spectrometry

99.9% Ultra-Pure Iron | Electron Beam Refined for Critical Applications

- Electron Beam Melting (EBM): Eliminates gaseous impurities (O, N, H) to sub-ppm levels.

- Zone Refining: Achieves single-crystal structure for uniform electromagnetic behavior.

- Quality Control: 100% inspected with EDX and XPS to map surface contaminants.

- Semiconductor Manufacturing:

- Sputtering targets for MRAM/ReRAM memory layers.

- Etch-resistant chambers liners (reduces particle shedding by 90%).

- Superconductivity Research:

- Substrates for thin-film superconducting alloys (e.g., FeSe).

- Biomedical Engineering:

- Biocompatible implants with 99.9% purity to prevent inflammatory responses.

3. Competitive Advantages

Feature	Our 99.9% Iron	Standard 99.5% Iron
Crystallinity	Single-crystal structure	Polycrystalline with grain boundaries
Surface Cleanliness	Class 10 cleanroom packaging	Standard industrial packaging
Traceability	Lot-specific GDMS reports	Generic material certificates
Lead Time	10 days (1kg-1MT orders)	30+ days for customized specs